Cirrus-logic CS4970x4 Manual de usuario descargar pdf (Pagina 10)

CS4970x4 Data Sheet

32-bit High Definition Audio Decoder DSP Family

DS752F1 10

5.5 Thermal Data (128-pin LQFP)

Notes: 1. Two-layer board is specified as a 76 mm X 114 mm, 1.6 mm thick FR-4 material with 1-oz. copper covering 20% of the top and

bottom layers.

2. Four-layer board is specified as a 76 mm X 114 mm, 1.6 mm thick FR-4 material with 1-oz. copper covering 20% of the top and

bottom layers and 0.5-oz. copper covering 90% of the internal power plane and ground plane layers.

3. To calculate the die temperature for a given power dissipation



= Ambient Temperature + [ (Power Dissipation in Watts) * 

]

4. To calculate the case temperature for a given power dissipation



= 

- [ (Power Dissipation in Watts) * 

Parameter Symbol Min Typ Max Unit

Thermal Resistance (Junction to Ambient)

Two-layer Board

Four-layer Board



—

°C / Watt

Thermal Resistance (Junction to Top of Package)

Two-layer Board

Four-layer Board



—

.45

.39

—

°C / Watt

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Cirrus-logic CS4970x4 Manual de usuario Pagina 10